contact wafer

contact wafer
contact wafer Schaltplatte f

English-German dictionary of Electrical Engineering and Electronics. 2013.

Игры ⚽ Поможем сделать НИР

Schlagen Sie auch in anderen Wörterbüchern nach:

  • Non-contact wafer testing — Wafer testing is a normal step in semiconductor device fabrication, used to detect defects in integrated circuits (IC) before they are assembled during the IC packaging step. Traditional (contact) wafer testing Probing ICs while they are still on …   Wikipedia

  • Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… …   Wikipedia

  • Wafer prober — A wafer prober is a machine used to test integrated circuits. OverviewIntegrated circuits are fabricated in large numbers by a complex series of printing steps on silicon wafers. This process permits integrated circuits to be produced cheaply but …   Wikipedia

  • Electrical Wafer Sorting — Pour les articles homonymes, voir EWS. L Electrical Wafer Sorting (E.W.S.) est un procédé permettant de trier les puces fonctionnelles sur les plaques de silicium dès leur sortie de l usine, avant leur mise en boîtier. Fonction EWS :… …   Wikipédia en Français

  • Micro contact printing — Figure 1: PDMS master is created by patterning silicon, pouring and curing the PDMS, and peeling away from the substrate …   Wikipedia

  • Optical contact bonding — is a glueless process whereby two closely conformal surfaces are joined together, being held purely by intermolecular forces. Contents 1 History 2 Explanation 3 Production of an optical contact bond 4 …   Wikipedia

  • Photolithography — For earlier uses of photolithography in printing, see Lithography. For the same process applied to metal, see Photochemical machining. Photolithography (or optical lithography ) is a process used in microfabrication to selectively remove parts of …   Wikipedia

  • Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …   Wikipedia

  • Solar cell — A solar cell made from a monocrystalline silicon wafer …   Wikipedia

  • materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… …   Universalium

  • Probe card — A probe card is an interface between an electronic test system and a semiconductor wafer. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the… …   Wikipedia

Share the article and excerpts

Direct link
Do a right-click on the link above
and select “Copy Link”